MP4024 2006-10-27 1 toshiba power transistor module silicon npn epitaxial type four darlington power transistors in one) MP4024 high power switching applications hammer drive, pulse motor drive and inductive load switching ? small package by full molding (sip 10 pins) ? built-in resistance (r b ). ? surge voltage is clamped by zener diode (c-b). ? low v ce (sat) : v ce (sat) = 1.5 v (max) (i c = 1 a, v bh = 4.2 v) ? high dc current gain: h fe = 2000 (min) (v ce = 2 v, i c = 1 a) absolute maximum ratings (ta = 25c) characteristics symbol rating unit collector-base voltage v cbo 85 v collector-emitter voltage v ceo 100 15 v emitter-base voltage v ebo 6 v input voltage v b 20 v dc i c 3 collector current pulse i cp 4 a collector power dissipation (1-device operation) p c 2.0 w collector power dissipation (4-device operation) p t 4.0 w junction temperature t j 150 c storage temperature range t stg ? 55 to 150 c note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/derating concept and methods) and indi vidual reliability data (i.e. reliability test report and estimated failure rate, etc). array configuration industrial applications unit: mm jedec D jeita D toshiba 2-25a1a weight: 2.1 g (typ.) 2 1 r1 r2 10 r1 5 k ? r2 300 ? 3 r b 4 5 6 7 8 9 r b 3.6 k ?
MP4024 2006-10-27 2 marking thermal characteristics characteristics symbol max unit thermal resistance from junction to ambient (4-device operation, ta = 25c) r th (j-a) 31.3 c/w maximum lead temperature for soldering purposes (3.2 mm from case for 10 s) t l 260 c electrical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit collector cut-off current i cbo v cb = 80 v, i e = 0 a D D 10 a collector cut-off current i ceo v ce = 80 v, i b = 0 a D D 10 a emitter cut-off current i ebo v eb = 6 v, i c = 0 a 0.3 D 1.5 ma collector- emitter breakdown voltage v (br) ceo i c = 10 ma, i b = 0 a 85 100 115 v resistance r b D 2.5 3.6 4.7 k ? h fe (1) v ce = 2 v, i c = 1 a 2000 D D dc current gain h fe (2) v ce = 2 v, i c = 2 a 1000 D D D v ce (sat) (1) i c = 1 a, v bh = 4.2 v D D 1.5 collector-emitter saturation voltage v ce (sat) (2) i c = 1.5 a, v bh = 9 v D D 1.5 v input voltage (low) v bl v ce = 50 v, i c = 100 a D D 0.7 v turn-on time t on D 0.3 D storage time t stg D 4.0 D switching time fall time t f duty cycle 1% D 0.6 D s 20 s v cc = 30 v 30 ? input 0v v bh = 5 v MP4024 japan lot no. a line indicates lead (pb)-free package or lead (pb)-free finish. part no. (or abbreviation code)
MP4024 2006-10-27 3 ambient temperature ta (c) p t ? ta total power dissipation p t (w) total power dissipation p t (w) t j ? p t junction temperature increase t j (c) 1 2 3 4 0 160 40 80 120 5 0 attached on a circuit board (1) 1-device operation (2) 2-device operation (3) 3-device operation (4) 4-device operation circuit board (1) (2) (3) (4) collector-emitter voltage v ce (v) safe operating area collector current i c (a) r th ? t w pulse width t w (s) transient thermal resistance r th (c/w) -no heat sink/attached on a circuit board- (1) 1-device operation (2) 2-device operation (3) 3-device operation (4) 4-device operation circuit board 100 0.001 0.01 0.1 1 10 1000 0.5 1 3 10 30 100 300 curves should be applied in thermal limited area. (single nonrepetitive pulse) the figure shows thermal resistance per device versus pulse width. (4) (3) (1) (2) 0 8 40 2 4 6 80 120 160 200 0 (1) 1-device operation (2) 2-device operation (3) 3-device operation (4) 4-device operation attached on a circuit board circuit board (4) (3) (2) (1) 0.01 1 0.03 0.1 0.3 1 3 10 i c max (pulsed)* 10 ms* 1 ms* v ceo max 100 s* 3 10 30 100 *: single nonrepetitive pulse ta = 25c curves must be derated linearly with increase in temperature.
MP4024 2006-10-27 4 restrictions on product use 20070701-en ? the information contained herein is subject to change without notice. ? toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity a nd vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshib a products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconduct or devices,? or ?toshiba semiconductor reliability handbook? etc. ? the toshiba products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuri ng equipment, industrial robotics, domestic appliances, etc.).these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage incl ude atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, et c.. unintended usage of toshiba products listed in his document shall be made at the customer?s own risk. ? the products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba for any infringement s of patents or other rights of the third parties which may result from its use. no license is granted by implic ation or otherwise under any patents or other rights of toshiba or the third parties. ? please contact your sales representative for product- by-product details in this document regarding rohs compatibility. please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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